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OBSOLETE - PLEASE USE ZXMN2AMCTA
ZXMN2AM832
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @V GS =10V; T A =25 C (b) (f)
@V GS =10V; T A =70 C (b) (f)
SYMBOL
V DSS
V GS
I D
N-Channel
20
12
3.7
3.0
UNIT
V
V
A
A
@V GS =10V; T A =25 C
Pulsed Drain Current
Continuous Source Current (Body Diode) (b) (f)
Pulsed Source Current (Body Diode)
Power Dissipation at TA=25°C (a) (f)
Linear Derating Factor
Power Dissipation at TA=25°C (b) (f)
Linear Derating Factor
Power Dissipation at TA=25°C (c) (f)
Linear Derating Factor
Power Dissipation at TA=25°C ( d) (f)
Linear Derating Factor
Power Dissipation at TA=25°C (d) (g)
Linear Derating Factor
Power Dissipation at TA=25°C (e) (g)
Linear Derating Factor
Operating and Storage Temperature Range
(a) (f)
I DM
I S
I SM
P D
P D
P D
P D
P D
P D
T j :T stg
2.9
13
3.0
13
1.5
12
2.45
19.6
1
8
1.13
9
1.7
13.6
3
24
-55 to +150
A
A
A
A
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
W
mW/°C
°C
THERMAL RESISTANCE
PARAMETER
Junction to Ambient (a)(f)
Junction to Ambient (b)(f)
Junction to Ambient (c)(f)
Junction to Ambient (d)(f)
Junction to Ambient (d)(g)
Junction to Ambient (e)(g)
SYMBOL
R JA
R JA
R JA
R JA
R JA
R JA
VALUE
83.3
51
125
111
73.5
41.7
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
(a) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached . The
copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(b) Measured at t<5 secs for a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed
pads attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(c) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with minimal lead connections only.
(d) For a dual device surface mounted on 10 sq cm single sided 1oz copper on FR4 PCB, in still air conditions with all exposed pads attached
attached . The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(e) For a dual device surface mounted on 85 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached
attached . The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(f) For a dual device with one active die.
(g) For dual device with 2 active die running at equal power.
(h) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph.
(i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in the
package dimensions data. The thermal resistance for a dual device mounted on 1.5mm thick FR4 board using minimum copper 1 oz weight, 1mm
wide tracks and one half of the device active is Rth = 250°C/W giving a power rating of Ptot = 500mW.
ISSUE 3 - JANUARY 2005
SEMICONDUCTORS
2
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